Raumtemperaturstabile Vergussmasse und Drahtklebstoff

Introducing the newest product in the Dymax encapsulant family, dual-cure 9014, which is formulated to cure with UV light and then secondary moisture cure for shadow areas on printed circuit boards.


Dymax Corporation, a leading manufacturer of rapid curing materials and equipment, introduces the newest product in its encapsulant family, dual-cure 9014, which is formulated to cure with UV light and then secondary moisture cure for shadow areas on printed circuit boards.

Curing in seconds upon exposure to UV light energy, 9014 increases manufacturing efficiency because assembled parts can be moved quickly to the next step in production. This new formulation is also room-temperature stable, eliminating the need for cold-shipping and storage.

Für Hersteller, die mit Chip-on-Board-, Chip-on-Flex-und Chip-on-Glas-Baugruppen sowie Drahtklebung arbeiten, bietet dieses Material eine ausgezeichnete Flexibilität und erhöhte Haltbarkeit und Widerstandsfähigkeit auf Leiterplatten. 9014 bietet auch einen guten Feuchtigkeits- und Korrosionsschutz für kritische Komponenten, die in elektronischen Anwendungen wie Batteriemanagementsystemen für Elektrofahrzeuge zu finden sind. Recommended surfaces include Kapton, glass, and FR4.

If you are interested in seeing a demonstration of this product, Dymax will be exhibiting at The Battery Show 2019 in Novi, MI, at the Suburban Collection Showcase, booth 2245, September 10-12th. Technical experts will be on hand to answer all your questions.
 

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