One Part, Optical Epoxy Using UV/Visible Light and Heat Cure

A case study on using ultraviolet and heat cure to secure a camera module holder to a PCB.


Accurately align the camera module holder to the PCB using both UV and heat curing.

A manufacturer specializing in automotive active alignment assembly wanted a cost-effective adhesive that could cure using both UV light and heat. The customers also needed the product to have very good thixotropy to keep the bead shape when dispensing and UV curing. Additionally, the adhesive required a bond strength averaging 20kgf.


9906-AA low shrinkage camera module adhesive for active alignment applications.

The Dymax team met with the customer to review their assembly process and understand their application needs. After review, the team recommended 9906-AA low shrinkage camera module epoxy  with high thixotropy. This adhesive is a one-part solution with the flexibility to cure in seconds with UV/Visible light and low temperature heat cure. It's an ideal adhesive for complex optical positioning such as micron accuracy. 


The Dymax solution resulted in high thixotropy, flexible UV or heat-cure epoxy that precisely aligned and cured the camera module components all while reducing costs.

By using dual ultraviolet light and low-temperature heat cure, the customer was able to:

  1. - Reduce the total processing costs by using a cost effective UV/Visible and heat-cure solution
  2. - Gain efficiencies by using a one component epoxy that doesn't require frozen storage
  3. - Meet thixotropy and bond strength requirements to pass active alignment testing


A manufacturer was looking for an alternative adhesive for their automotive camera module line. Their current active alignment process was slow, driving down throughput. Dymax was able to offer a solution using 9803 low shrink epoxy that allowed the manufacturer to reduce their overall processing time by 79%, as well as achieve higher bond strength, a reduction in shrinkage, and lower shipping and handling costs.

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