Electronics in the optical and telecommunications industries demand specialized adhesives, coatings, and encapsulants that ensure precise alignment, long-term clarity, and structural protection. Dymax light-curable materials assist manufacturers in developing optoelectronic devices, optical modules, and telecom infrastructure by enhancing process speed, assembly accuracy, and resistance to environmental factors.
Application Solutions
Optoelectronics Assembly – Light-curable adhesives for low-shrink, low-stress bonding that enables high-precision alignment and secure fixturing of lenses, sensors, VCSELs, and other photonic components.
Telecom Electronics Assembly – Light-curable encapsulants and coatings for optical modules and PCBs that ensure signal integrity, mechanical reliability, and environmental durability.
