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Telecom Assembly
Optical Module Bonding & PCB Protection for Telecom Electronics
Telecom electronics demand adhesives and coatings that ensure reliability in high-density, high-speed applications. Dymax light-curable materials are designed for bonding optical modules and protecting PCB assemblies under thermal, mechanical, and environmental stress. These materials offer precise placement, fast curing, and long-term performance—helping telecom manufacturers meet throughput goals while maintaining signal integrity and durability.
Key Product Capabilities Include:
- Structural adhesives for optical module bonding
- Encapsulants for component protection and shock absorption
- Conformal coatings for long-term reliability and board protection
- Materials designed to maintain signal fidelity under environmental stress
Applications include optical module assembly, fiber-optic bonding, PCB encapsulation and coating, wire and chip protection, and reinforcement of electronics in telecom applications.
Merkmale
- Low-shrink, high-precision bonding for optical modules
- Moisture-, impact-, and vibration-resistant encapsulants
- Conformal coatings for PCB protection and insulation
- UV/Dual-cure options for full cure in shadowed areas
- One-component, reworkable chemistries
- Compatible with automated assembly systems